| 摘要 |
<P>PROBLEM TO BE SOLVED: To equalize physical property values on an upper surface side and a lower surface side of a semiconductor chip mounted on a wiring board. <P>SOLUTION: A semiconductor device includes the semiconductor chip, the wiring board having a semiconductor mounting region where the semiconductor chip is mounted, and a sealing resin for sealing the semiconductor chip on the semiconductor mounting region. At least one projection is provided in the semiconductor mounting region of the wiring board so that the thickness of the sealing resin is equal between a part located on the upper surface side of the semiconductor chip and a part located on the lower surface side of the semiconductor chip, and the semiconductor chip is placed on the projection. <P>COPYRIGHT: (C)2011,JPO&INPIT |
