| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a silicon wafer capable of improving the process yield, as well as, preventing production efficiency from degrading, in manufacture of the silicon wafer from a silicon ingot. <P>SOLUTION: In polishing of the surface of a silicon block, time required for polishing the surface of the silicon block can be significantly shortened, by using an endless abrasive belt 30 (diamond polishing cloth) as a polishing tool. Moreover, unlike the case of polishing by a diamond wheel, in polishing by the endless abrasive belt 30 (diamond polishing cloth), elastic polishing is possible; and thereby, minute cracks occurring on the surface of the silicon block during polishing the surface can be reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
