| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a module capable of solving a problem such that there may occur whitened portions and cracks in dividing when a module part is intended to manufacture by dividing a sealing structure body, which is composed of a circuit substrate, parts mounted on the circuit substrate, and a sealing portion sealing them, into pluralities by dicing. <P>SOLUTION: The module 101 includes a circuit substrate 110 in which copper foils 106 of one or more layers are built in by impregnating an epoxy resin into a core material, a sealing portion 109 sealing one or more electronic parts 107 mounted on the circuit substrate 110 and the electronic parts 107 on the circuit substrate 110, and a metal film 102 covering a side surface of the circuit substrate 110 and a surface of the sealing portion 109. The sealing portion 109 and the circuit substrate 110 are approximately same square, and a part of the copper foil 106 exposes at a plurality of side surfaces of the circuit substrate 109. A width of an exposed portion 111 of the copper foil 106 is 200μm or less, and the copper foil 106 and the metal film 102 are electrically connected through the exposed portion 111, thereby occurrence of whitening or cracks can be prevented. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
