| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing, having excellent continuous formability, solder reflow property, mold releasability in sealing of a semiconductor device, surface appearance of a cured resin and mold staining resistance. SOLUTION: The epoxy resin composition for semiconductor sealing contains (A) a first epoxy resin, (B) a curing agent based on a phenolic resin, (C) an organopolysiloxane (c1) having a polycaprolactone group and/or a reaction product (c2) of the organopolysiloxane (c1) having the polycaprolactone group with a second epoxy resin, and (D) an oxidized polyethylene. COPYRIGHT: (C)2011,JPO&INPIT |
