发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent more rigidly the transmission of moisture or the like from an opening part for a fuse to outside a guard ring. SOLUTION: A silicon fuse 5, a silicon wiring pattern 7, and a silicon guard ring 9 are formed on an insulating underlayer 3. The silicon guard ring 9 surrounds the periphery of the silicon fuse 5 and has a silicon cutout part 9a so as not to contact the silicon wiring pattern 7. A via guard ring 15 having a via cutout part 15a on the silicon cutout part 9a is formed in an insulating interlayer 11 provided on the silicon guard ring 9. An annular metal wiring guard ring 17 is formed on the insulating interlayer 11 and the via guard ring 15. A silicon nitride film 19 is formed on the insulating interlayer 11 while covering the metal wiring guard ring 17. The boundary face between the insulating interlayer 11 and the metal wiring guard ring 17 at the via cutout part 15a is covered by the silicon nitride film 19. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011077466(A) 申请公布日期 2011.04.14
申请号 JP20090230167 申请日期 2009.10.02
申请人 RICOH CO LTD 发明人 OSHIMA MASASHI;OTSUKA MASAYA
分类号 H01L21/82;H01L21/3205;H01L23/52 主分类号 H01L21/82
代理机构 代理人
主权项
地址