发明名称 |
Apparatus and Method for Through Silicon via Impedance Matching |
摘要 |
Methods and apparatuses for matching impedances in a flip-chip circuit assembly are presented. An apparatus for matching impedances in a flip-chip circuit assembly may include a first circuit associated with a first die and a through silicon via (TSV) coupling the first circuit to a second circuit. The apparatus may further include a first impedance matching inductor interposed between the TSV and the second circuit. A method for matching impedances in a flip-chip circuit assembly may include providing a die having a first circuit, and forming a TSV over the die. The method may further include providing a second circuit and forming a first impedance matching inductor interposed between the TSV and second circuit.
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申请公布号 |
US2011084358(A1) |
申请公布日期 |
2011.04.14 |
申请号 |
US20090576094 |
申请日期 |
2009.10.08 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
KIM JONGHAE;YANG JEONG HWAN;NOWAK MATTHEW M. |
分类号 |
H01L29/66;H01L21/02;H01L21/768;H03H7/38 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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