| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric-wafer structure that can resolve a problem of the lowering of an yield of a piezoelectric wafer caused by the damage of the piezoelectric wafer resulting form handling when dicing the piezoelectric wafer having a large area by mechanical strength reduced by reducing a thickness to several tens of μm through mechanical polishing into a plurality of piezoelectric chip pieces by means of a subsequent photolithography process. <P>SOLUTION: The piezoelectric wafer structure includes a thin-plate region 2 and a thick frame body 3 integrated with an outer peripheral edge of the thin-plate region. <P>COPYRIGHT: (C)2011,JPO&INPIT |
