| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a catadioptric projection objective capable of achieving lithographic manufacture of semiconductor components having uniform quality. <P>SOLUTION: The catadioptric projection objective (1) for microlithography for imaging an object field (3) in an object plane (5) onto an image field (7) in an image plane (9) comprises: a first partial objective (11) for imaging the object field onto a first real intermediate image (13); a second partial objective (15) for imaging a first intermediate image onto a second real intermediate image (17); and a third partial objective (19) for imaging the second intermediate image onto the image field (7). The second partial objective (15) has exactly one concave mirror (21) and at least one lens (23). The minimum distance between an optically utilized region of the concave mirror (21) and an optically utilized region of a surface (25), facing the concave mirror, of a lens (23) adjacent to the concave mirror is greater than 10 mm. <P>COPYRIGHT: (C)2011,JPO&INPIT |
