发明名称 METHOD FOR TRANSPOSING HOLOGRAM INTO MOLDED MATERIAL BY USING MICRO UNEVENNESS HOLOGRAM
摘要 <p>The present invention relates to a method for transposing hologram into a molded material, and more specifically, to a method for transposing hologram into a molded material by integrating an injection mold with a sheet to which micro unevenness hologram is transposed. According to the present invention, the method for transposing the hologram into the molded material by using the micro unevenness hologram comprises the steps of: a micro unevenness hologram formation step for forming the hologram with micro unevenness on a metal plate by laser; a hologram sheet transposing step for transposing the micro unevenness hologram into the sheet fabric such as PET, PC, PVC or PP or the like; a sheet insertion step for inserting the sheet to which the micro unevenness hologram is transposed into the injection mold, and sticking the sheet to the injection mold by a vacuum generator; and a hologram molded material transposing step for injecting resin into the injection mold, and transposing the micro unevenness hologram formed on the sheet into the molded material via heating and cooling processes.</p>
申请公布号 WO2011043525(A1) 申请公布日期 2011.04.14
申请号 WO2010KR02615 申请日期 2010.04.27
申请人 JANGHAN INPLA CO., LTD.;SUN KYONG HOLOGRAM CO., LTD.;JANG, MYUNG SUP;HAN, MI SOOK;JEONG, CHANG KI;LEE, HWA SUL 发明人 JANG, MYUNG SUP;HAN, MI SOOK;JEONG, CHANG KI;LEE, HWA SUL
分类号 B29C45/14 主分类号 B29C45/14
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