Method for manufacturing micromechanical device, involves arranging micro-electro-mechanical system structures and bond contact surfaces respectively in rows on micro-electro-mechanical system-wafer

摘要

The method involves arranging the micro-electro-mechanical system structures and bond contact surfaces respectively in rows on the micro-electro-mechanical system-wafer (a). The recesses are formed to the micro-electro-mechanical system-structures and to the bond contact surfaces in the cap wafer (b). The micro-electro-mechanical system-wafer and the cap wafer are joined to the wafer composite (c). The spacer wafer is a silicon wafer and consists of plastic or adhesive. An independent claim is also included for a method for manufacturing a cap wafer of a micro-electro-mechanical system-wafer composite for a micromechanical device, particularly a sensor or an actuator.