| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that can shut off a water absorption path for the boundary surface between a die pad and a conductive adhesive material while improving the adhesiveness of the two, and can prevent a conductivity failure of the die pad and a conductive adhesive material and is excellent in electrical characteristic. <P>SOLUTION: The semiconductor light-emitting device 1 has an insulating substrate 2, a die pad 31 disposed on the first surface 2A of the insulating substrate 2, a conductive adhesive material 4 disposed on the upper surface 31A and side face 31S of the die pad 31 and getting at the first surface 2A of the insulating substrate 2 around the side face 31S of the die pad 31, a light-emitting element 5 with a conductive adhesive material 4 on the upper surface 31A of the die pad 31, which is electrically and mechanically connected to one main electrode 51, and a light transmissive resin 7 covering the die pad 31, conductive adhesive material 4, and light-emitting element 5, which is disposed on the first surface 2A of the insulating substrate 2. <P>COPYRIGHT: (C)2011,JPO&INPIT |
