| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the size of a temperature control structure of an optical module while suppressing formation of a solder ball. <P>SOLUTION: The temperature control structure of the optical module includes a temperature control element having an element upper surface whose temperature is controlled, a thermally conductive carrier having a carrier lower surface disposed on a predetermined region on the element upper surface and a carrier side face inclined to the outside upward from the carrier lower surface, and solder filled into a hollow formed of the element upper surface and carrier side face outside the predetermined region. The hollow functions as a solder pool to suppress formation of a solder ball. <P>COPYRIGHT: (C)2011,JPO&INPIT |
