| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat transfer apparatus having good adhesion and heat conductivity for a non-planar vessel having a temperature regulating part so as to be used in gene inspection etc., and to provide a gene treating apparatus carrying out temperature control by closely contacting a heat transfer part for performing a gene amplification reaction for a gene analysis chip having an uneven surface without a gap and without depending on variation of processing dimensions of the gene analysis chip, performing the gene amplification reaction, and thereby improving the reactivity of the gene amplification reaction. SOLUTION: The heat transfer apparatus performs heat conduction with a protruding site of the object, and includes a heat transfer block 9 having a recessed part provided correspondingly to the protruding site and a low-melting metal layer 14 formed in the recessed part. COPYRIGHT: (C)2011,JPO&INPIT |
