发明名称 ULTRASONIC RADIATOR DEVICE TO BE MOUNTED TO OUTSIDE OF HEADPHONE
摘要 PROBLEM TO BE SOLVED: To solve such a problem in an ultrasonic radiator device which has an ultrasonic radiator mounted to a tip of an arm extended from a casing of a headphone and can improve the sound quality of the headphone, but is required to further enhance its portability and fashionability by making the device small and light in size and weight when it is used for a portable audio player. SOLUTION: A plurality of head phone connectors are mechanically connected to a casing 3 having an ultrasonic radiator 2 built herein. The headphone connectors are electrically connected to the ultrasonic radiator in parallel with each other so that the ultrasonic radiator device 36 can be regarded as part of a head phone cable, thus solving the above problem. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011077991(A) 申请公布日期 2011.04.14
申请号 JP20090229514 申请日期 2009.10.01
申请人 TAKEI TOSHITAKA 发明人 TAKEI TOSHITAKA
分类号 H04R1/10 主分类号 H04R1/10
代理机构 代理人
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