| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having low viscosity when formed into a varnish while maintaining excellent dielectric characteristics of PPE, and excellent in heat resistance of resultant cured products. SOLUTION: The resin composition includes (A) a reaction product containing a low molecular weight polyphenylene ether having a ratio of a weight average molecular weight to a number average molecular weight, which is 500-3,000, of 1-3, and an epoxy resin, and obtained by preliminarily reacting at least part of hydroxyl groups of the low molecular weight polyphenylene ether with epoxy groups of the epoxy resin, (B) a cyanate resin having two more cyanate groups in average in one molecule, and (C) a curing accelerator. The epoxy resin includes a first epoxy resin having a number average molecular weight of≤600 and having 1.5 to 2.4 epoxy groups in average in one molecule and a second epoxy resin having a number average molecular weight of≤1,000 and having 2.5 to 4.4 epoxy groups in average in one molecule. COPYRIGHT: (C)2011,JPO&INPIT
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