发明名称 Device and Process for Making a Multilayer Circuit Device Having Electrically Isolated Tightly Spaced Electrical Current Carrying Traces
摘要 A multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces and including a first nonconductive substrate having a first conductive material affixed to a first side thereof to form a first ground plane, a plurality of elongated first conductive traces formed on a second side of the first non-conductive substrate and having transverse widths of 50 microns or less and rising above the upper surface of the first substrate to a height equal to or greater than the widths thereof such that a transverse cross section of the first conductive traces has a height-to-width ratio equal to or exceeding 1, adjacent ones of the first traces being separated from each other by first elongated spaces, the first conductive traces being variously useful as ground lines, signal lines and/or power lines.
申请公布号 US2011083881(A1) 申请公布日期 2011.04.14
申请号 US20100969478 申请日期 2010.12.15
申请人 NGUYEN VINH T;HAMRICK CLAUDE A S 发明人 NGUYEN VINH T.;HAMRICK CLAUDE A.S.
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
代理机构 代理人
主权项
地址