发明名称 Thermal Interface Device
摘要 Device including enclosure, plurality of particles, and matrix material. Particles are formed of material having substantial bulk thermal conductivity of at least about one watt per meter-Kelvin (1 W/[mK]) at standardized measurement temperature of about 68° F. Particles are dispersed in matrix material and encapsulated in enclosure. Enclosure is configured, upon deformation, to allow portion of matrix material to escape while retaining at least portion of particles within enclosure. System that includes device. Method that includes providing enclosure, first object having first surface, and second object having second surface. Method also includes placing enclosure between first and second surfaces and pressing first and second surfaces together, causing enclosure to be deformed allowing portion of matrix material to escape while retaining portion of particles within enclosure.
申请公布号 US2011086196(A1) 申请公布日期 2011.04.14
申请号 US20090577148 申请日期 2009.10.09
申请人 ALCATEL-LUCENT USA INC. 发明人 SALAMON TODD R.
分类号 B32B1/06;B29C67/00 主分类号 B32B1/06
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