发明名称 POLYMER COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING CURED RELIEF PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a polymer compound with a rapid alkali dissolution rate and excellent in pattern-forming properties, a photosensitive resin and a method for forming cured relief patterns. <P>SOLUTION: The polymer compound has a repeating unit expressed by general formula (1), wherein Ar<SB>1</SB>and Ar<SB>2</SB>each independently represent a 6-30C, 3-6 valent organic group which may be substituted with a substituent or substituents; Ar<SB>3</SB>represents a 6-30C, 2-6 valent organic group which may be substituted with a substituent or substituents; Y<SB>1</SB>, Y<SB>2</SB>and Y<SB>3</SB>each independently represent an acidic group protected with an acidic group or an acid-degradable group; Z represents a linking group and may form a ring with at least one of Ar<SB>1</SB>and Ar<SB>2</SB>; a and b each independently represent an integer of 1-4; c represents an integer of 0-4; n represents a repeating number and is 2-5,000. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011074314(A) 申请公布日期 2011.04.14
申请号 JP20090229780 申请日期 2009.10.01
申请人 FUJIFILM CORP 发明人 NAKAI YOSHIHIRO;AMAMIYA TAKUMA
分类号 C08G65/40;G03F7/004;G03F7/023;G03F7/039 主分类号 C08G65/40
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