发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of preventing a treatment liquid from being electrostatically charged by a simple constitution. SOLUTION: The substrate treatment apparatus includes a spin chuck which holds a substrate substantially horizontally and rotates it, and a chemical supply path for supplying a chemical to the substrate held by the spin chuck. The chemical supply path is interposed in a temperature controller 24 which controls a temperature of the chemical sent toward a chemical supply nozzle to a fixed temperature suitable for treatment. The temperature controller 24 includes a heat conductive plate 242 which forms a chemical flow passage and is conductive. One end of a metal wire 242a is connected to the heat conductive plate 242, and the other end of the metal wire 242a is grounded. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011077145(A) 申请公布日期 2011.04.14
申请号 JP20090224736 申请日期 2009.09.29
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KAWAKAMI SHIGENORI
分类号 H01L21/306;H01L21/304 主分类号 H01L21/306
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