RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SEMICONDUCTOR DEVICE LEAD FRAME OBTAINED USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for optical semiconductor devices which has excellent thermal discoloration resistance and excellent light degradation resistance and to which satisfactory light-reflecting properties can be imparted.

SOLUTION: In a resin layer 3 formed around a metallic lead frame 1 and an optical semiconductor element 2 mounted thereon, the resin layer 3 forming material consists of the resin composition for optical semiconductor devices containing following ingredients (A) to (D): (A) an epoxy resin, (B) a curing agent, (C) polyorganosiloxane, and (D) a white pigment.

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