| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new constitution, and to secure good light emission balance and heat exhausting properties when a light emission surface of a light emitting device has a small square shape, in a light emitting device including an LED chip mounting area in a first lead and a bonding area of wire from an LED chip in a second lead wherein both leads are surrounded by a package resin part. <P>SOLUTION: In a lighting system, a part opposite to a second lead in a first lead 11 is formed to be a thin part 13, an LED chip 3 is mounted on the surface side of the thin part 13, and a resin material of a package resin part 31 is allowed to extend to the rear surface side of the thin part 13. <P>COPYRIGHT: (C)2011,JPO&INPIT |
