HEAT AGING RESISTANT POLYAMIDE COMPOSITIONS INCLUDING POLYHYDROXY POLYMERS

摘要

Disclosed is a thermoplastic composition including A) a polyamide resin having a melting point and/or glass transition; B) 0.25 to 20 weight percent of at least one polyhydric polymer; C) 0 to 3 weight percent of one or more co-stabilizer(s); and, D) 0 to about 60 weight percent of one or more reinforcement agents, wherein said polyamide resin is selected from the group consisting of Group (III) Polyamides having said melting point of at least 210 °C, and including about 20 to about 35 mole percent semiaromatic repeat units, Group (IV) Polyamides comprising about 50 to about 95 mole percent semiaromatic repeat units, Group (V) Polyamides having said melting point of at least 260 °C, and including greater than 95 mole percent semiaromatic repeat units, and Group (VI) Polyamides having no melting point; with the proviso that when less than 10 weight percent said one or more reinforcement agent(s) is present, at least 0.1 weight % of said one or more co-stabilizer(s) also is present.