| 摘要 |
Provided is a leadframe which can eliminate a dam bar cutting/removing step after resin sealing, in manufacture of resin-sealed semiconductor device. A dam-bar-free leadframe, which has a plurality of outer leads and a plurality of inner leads and does not have a dam bar, is formed by machining a metal thin plate, a resin solution of an insulating thermosetting resin or a resin solution of an ultraviolet curable resin is applied on the front surface or the rear surface of the leadframe in an inner lead area, the applied resin solution which has flowed into a space between the leads is moved to a boundary between the outer lead and the inner lead through a lead side wall by operation of surface tension, and the leadframe is manufactured by forming a resin dam bar by curing the applied resin solution at the boundary. Thus, the leadframe, which leaves no resin residual on the front and rear surfaces of the leadframe at the resin dam bar position, is provided. |
