| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a lead of an electronic component capable of manufacturing the lead of the electronic component with molten solder restrained from travelling over the lead, and a manufacturing device of the lead of the electronic component. <P>SOLUTION: In the manufacturing method of a lead for an electronic component, a first laser is irradiated on an Au-layer 23c laminated on further outside than an Ni-layer 23b of the lead used for the electronic component with a higher solder wettability than the Ni-layer 23b, whereby, a first layer is made exposed from a second layer, and a second laser is irradiated on the first layer exposed, whereby, a convex part is formed around an area where the second laser is irradiated. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
