| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame which prevents air from being retained on its reverse surface side during batch resin sealing, and to provide a method of manufacturing a semiconductor device using the same. <P>SOLUTION: The lead frame 1 is prepared which has a grooved thin part 7 formed at a tie bar 5 on a reverse surface side of a mounting surface for a semiconductor element, the grooved thin part being extended up to a cradle part 2 and having its end linked to the mounting surface for the semiconductor element through a through hole 12. The semiconductor element is mounted on a die pad 4 on the mounting surface of the lead frame, and an electrode of the semiconductor element and an inner lead 3 of the lead frame are connected to each other. The lead frame is clamped so that the through hole is positioned in a cavity of a sealing metal mold, and a sealing resin is injected into the thin part and cavity to seal the lead frame together. Then the tie bar and a part of the sealing resin are cut away to obtain individual semiconductor devices as individual pieces, thus completing the semiconductor devices. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
