METHOD OF MANUFACTURING LEAD FRAME SUBSTRATE FOR LIGHT EMITTING ELEMENT, LEAD FRAME SUBSTRATE FOR LIGHT EMITTING ELEMENT, AND LIGHT EMITTING MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a lead frame substrate for a light emitting element that can have a reflector part molded in a body while suppressing manufacturing costs, and enables high heat dissipation characteristics and high light use characteristics, to provide a lead frame substrate for the light emitting element, and to provide a light emitting module.

SOLUTION: The lead frame substrate for the light emitting element B is manufactured by including: a resist laminating process of laminating resist 21 on a metal plate 20; a resist pattern forming process of forming a resist pattern 22 on the metal plate 20; an etching process of forming a lead frame part 4 by etching the metal plate 20; a resin printing installing process of arranging a resin printing 24 on sides of top surfaces 6a and 7a of the lead frame part 4; a filling resin coating process of coating reverse surfaces 6b and 7b of the lead frame part 4 with a filling resin 25; and a resin pressing/curing process of filling a cavity H with a filling resin 25 by pressing the filling resin 25 via a mold releasing film 26 to mold a resin part 5 including the reflector part 16.

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