| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has excellent storage stability and is well-balanced and excellent in points of heat resistance, light resistance, and adhesive strength after curing, particularly an epoxy resin composition which has excellent storage stability and is suitable for providing a semiconductor light emitting device such as an LED having excellent heat resistance and light resistance. <P>SOLUTION: The epoxy resin composition contains (A) an epoxy resin expressed by general formula (1) and (B) 2-ethyl magnesium hexanoate, wherein the content of (B) component is 0.5-4 pts.wt. based on 100 pts.wt. (A) component. <P>COPYRIGHT: (C)2011,JPO&INPIT |
