| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield of manufacture by preventing the occurrence of cracks of an insulating layer formed on a mold releasing film and the separation of the mold releasing film during a substrate manufacturing process. SOLUTION: The method includes: a step of preparing for a pair of raw materials 10 and an adhesive layer 20 on which a mold releasing film 11 and a first insulating layer 12 are sequentially laminated; a step of embedding into the adhesive layer 20 the pair of raw materials 10 by letting them face to each other so that the mold releasing film 11 can go toward an inner layer; a step of forming a second insulating layer 32 inside which a via is put through, and on whose surface a circuit pattern connected to the via is formed on the first insulating layer 12; a step of cutting the edge sections of the second and first insulating layers 32 and 12, the mold releasing film 11 and the adhesive layer 20; and a step of removing the mold releasing film 11 from the first insulating layer 12. COPYRIGHT: (C)2011,JPO&INPIT |
