| 发明名称 |
SEMICONDUCTOR DEVICE HAVING METAL WIRINGS OF LAMINATED STRUCTURE |
| 摘要 |
A semiconductor device that includes a metal wiring formed on the insulating film and having a main wiring portion laminated with a plurality of metal films and a metal protection film formed at least on the upper surfaces of the main wiring portion and made of a precious metal material.
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| 申请公布号 |
US2011086508(A1) |
申请公布日期 |
2011.04.14 |
| 申请号 |
US20100972742 |
申请日期 |
2010.12.20 |
| 申请人 |
FUJITSU SEMICONDUCTOR LIMITED |
发明人 |
KIKUCHI HIDEAKI;NAGAI KOUICHI;MIURA JIROU |
| 分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
| 代理机构 |
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代理人 |
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