| 摘要 |
The present invention relates to a dispersion for the application of a metal layer on a non-electrically-conductive substrate comprising an organic binder component, a metal component, and also a solvent component. The invention further relates to processes for the production of the dispersion, processes for the production of a non-structured or structured metal layer with the aid of the dispersion, and also to the resultant substrate surfaces and their use.
|
