发明名称 MULTILAYER CHIP CAPACITOR
摘要 A multilayer chip capacitor includes a capacitor body, a plurality of internal electrodes, and a plurality of external electrodes. The capacitor body is formed of a ceramic sintered product and has first and second side surfaces facing each other. The plurality of internal electrodes each of which has two leads extending to the first and second side surfaces of the capacitor body, respectively, are arranged such that the internal electrodes with one polarity and the internal electrodes with the other polarity are alternately stacked inside the capacitor body. The plurality of external electrodes are formed on the first and second side surfaces of the capacitor body along a stacked direction of the internal electrodes such that the external electrodes with one polarity and the external electrodes with the other polarity are alternately arranged on each of the first and second side surfaces, and are connected to the leads.
申请公布号 US2011085277(A1) 申请公布日期 2011.04.14
申请号 US20100694926 申请日期 2010.01.27
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HUR KANG HEON;CHAE EUN HYUK;WI SUNG KWON;KIM DOO YOUNG;PARK DONG SEOK;LEE BYOUNG HWA;PARK SANG SOO;PARK MIN CHEOL;CHUNK HAE SUK
分类号 H01G4/005;H01G4/002 主分类号 H01G4/005
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