A METAL LAYER STRUCTURE COMPRISING ELECTROLESS NI PLATING LAYER AND A FABRICATING METHOD THE SAME

摘要

PURPOSE: A metal wiring structure including an electroless nickel plating layer and manufacturing method thereof are provided to minimize stress on an interface by forming an electroless nickel plating layer with a wet process. CONSTITUTION: An electroless nickel plating layer(220) is formed on an insulation layer. A surface processing layer(240) is formed on the electroless nickel plating layer. An insulation layer is an anode oxide layer, a ceramic based resin layer, an epoxy based resin layer, or a silicon based resin layer. The electroless copper plating layer is formed on the electroless nickel plating layer.