发明名称 |
DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE AND PORTABLE APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device mounting board which has bump electrodes capable of enhancing reliability in connection with a semiconductor device. <P>SOLUTION: The device mounting board 20 includes: an insulating resin layer 32; a wiring layer 34 provided on one principal surface S1 of the insulating resin layer 32; and bump electrodes 36 electrically connected with the wiring layer 34 and protruding to the insulating resin layer 32 side from the wiring layer 34. A semiconductor device 50 is electrically connected to the bump electrodes 36, so that a semiconductor module 10 is formed. A recess is provided on each top surface of the bump electrodes 36. The recess communicates to an opening each provided on sides of the bump electrodes 36. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011077345(A) |
申请公布日期 |
2011.04.14 |
申请号 |
JP20090228104 |
申请日期 |
2009.09.30 |
申请人 |
SANYO ELECTRIC CO LTD |
发明人 |
NAKAZATO MAYUMI;SAITO KOICHI;YAMAMOTO TETSUYA |
分类号 |
H01L23/12;H01L21/3205;H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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