| 摘要 |
A method of fabricating MEMS device includes: providing a substrate with a first surface and a second surface. The substrate includes at least one logic region and at least one MEMS region. The logic region includes at least one logic device positioned on the first surface of the substrate. Then, an interlayer material is formed on the first surface of the substrate within the MEMS region. Finally, the second surface of the substrate within the MEMS region is patterned. After the pattern process, a vent pattern is formed in the second surface of the substrate within the MEMS region. The interlayer material does not react with halogen radicals. Therefore, during the formation of the vent pattern, the substrate is protected by the interlayer material and the substrate can be prevented from forming any undercut.
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