发明名称 |
METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME |
摘要 |
Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated.
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申请公布号 |
US2011083885(A1) |
申请公布日期 |
2011.04.14 |
申请号 |
US20090630478 |
申请日期 |
2009.12.03 |
申请人 |
KIM TAE HYUN;CHOI SEOG MOON;KIM TAE HOON;SHIN SANG HYUN;LEE YOUNG KI;PARK SUNG KEUN |
发明人 |
KIM TAE HYUN;CHOI SEOG MOON;KIM TAE HOON;SHIN SANG HYUN;LEE YOUNG KI;PARK SUNG KEUN |
分类号 |
H05K1/09;B05D5/12 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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