发明名称 METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME
摘要 Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated.
申请公布号 US2011083885(A1) 申请公布日期 2011.04.14
申请号 US20090630478 申请日期 2009.12.03
申请人 KIM TAE HYUN;CHOI SEOG MOON;KIM TAE HOON;SHIN SANG HYUN;LEE YOUNG KI;PARK SUNG KEUN 发明人 KIM TAE HYUN;CHOI SEOG MOON;KIM TAE HOON;SHIN SANG HYUN;LEE YOUNG KI;PARK SUNG KEUN
分类号 H05K1/09;B05D5/12 主分类号 H05K1/09
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