POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND ITS USE AS PROTECTIVE FILM, AS INSULATING FILM, IN SEMICONDUCTOR DEVICE AND DISPLAY DEVICE

摘要

An object of the present invention is to provide a positive photosensitive resin composition which has high sensitivity and which is highly heat resistant and reliable even when it is cured at a low temperature. Another object of the present invention is to provide a cured film which has high sensitivity and which is highly heat resistant and reliable even when it is cured at a low temperature, a protecting film, an insulating film and semiconductor and display devices using the same. The positive photosensitive resin composition of the present invention comprises a polyamide resin and a photosensitive agent, wherein the polyamide resin has a specific structure. The cured film of the present invention comprises a cured product of the positive photosensitive resin composition. The protecting film and insulating film of the present invention comprise the cured film each. The semiconductor device and display device of the present invention comprise the cured film each.