PURPOSE: A semiconductor package is provided to deposit semiconductor dies of the same structure by forming an enable side electrode and a dummy side electrode at an incline on the semiconductor dies. CONSTITUTION: A substrate has a wiring pattern for selecting a plurality of dies and a wiring pattern for a signal. A first semiconductor die(120) is electrically connected to the substrate. The first semiconductor die has penetration electrodes(123, 124) for selecting a die and a penetration electrode for the signal. A second semiconductor die(130) is electrically connected to the first semiconductor die and has the same structure as the first die.
申请公布号
KR20110037062(A)
申请公布日期
2011.04.13
申请号
KR20090094318
申请日期
2009.10.05
申请人
AMKOR TECHNOLOGY KOREA, INC.
发明人
CHA, SE WOONG;NA, SEOK HO;KIM, YOON JOO;GIM, BONG CHAN;PARK, JOON YOUNG