| 摘要 |
<p>PURPOSE: A semiconductor package and a method for manufacturing the same are provided to improve the stability of electrical connection between a substrate and a semiconductor device by forming a protrusion in the circuit pattern of a substrate. CONSTITUTION: In a semiconductor package and a method for manufacturing the same, a first region(I) and a second region(II) are formed on different regions in a semiconductor device(140). A plurality of pads(141) which is electrically connected to the substrate is formed on the first region. A circuit pattern is formed by etching a conductive material on the substrate to have a certain pattern A first adhesive layer of a conductive material bonds the first region and the substrate. A second adhesive layer of a non-conductive material bonds the second region and the substrate.</p> |
