<p>PURPOSE: A die bonding apparatus of a semiconductor is provided to increase the productivity by including two bonding heads for die-bonding semiconductor chips in one substrate alternately to reduce a cycle time. CONSTITUTION: In a die bonding apparatus of a semiconductor, a first bonding head(11) transfers a first semiconductor chip(1) along a transfer path to a bonding point on a substrate. A first transfer unit(13) moves the first bonding head and a second bonding head(12) transfers a second semiconductor chip to the bonding point along the transfer path. A second transfer unit(14) moves a second bonding head. A controller(15) applies a transfer signal and a return signal to the first and second transfer unit.</p>
申请公布号
KR20110037646(A)
申请公布日期
2011.04.13
申请号
KR20090095174
申请日期
2009.10.07
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, BYEONG KUK;GOH, SEOK;CHO, KYOUNG BOK;LEE, DONG SOO;WOO, JUNG HWAN