| 摘要 |
PURPOSE: A wafer support member, a method for manufacturing the same and a wafer polishing unit are provided to suppress a scratch on the surface of a wafer by processing the supporting part of a wafer support unit to be round or be coated with epoxy. CONSTITUTION: In a wafer support member, a method for manufacturing the same and a wafer polishing unit, a base substrate(220) is prepared. A supporting part(210) is adhered to the adhesive material in the edge of the base substrate. The outermost of the supporting part is processed to be round. A coating layer(215) is included in the edge of the supporting part. The coating layer is arranged to be wider than the round of the supporting part. |
