| 摘要 |
PURPOSE: A semiconductor package and a mobile phone comprising the same are provided to prevent semiconductor chips from being inclined to a substrate by forming a filling material around the semiconductor chip. CONSTITUTION: In a semiconductor package and a mobile phone comprising the same, first to fourth semiconductor chips(25,95,105,115) are on a substrate(10). The first to fourth semiconductor chips include a cascade shape in both sides. At least one connection wire(125) electrically connects the substrate the semiconductor chips. A filling auxiliary member(30) is arranged around the other side of the semiconductors. The filling auxiliary member includes a filling member(34) and or filling adhesives. |
