发明名称 Printed circuit board and method of manufacturing the same
摘要 A printed circuit board and method of manufacturing the printed circuit board, including a first and a second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of the second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.
申请公布号 US7923644(B2) 申请公布日期 2011.04.12
申请号 US20090611261 申请日期 2009.11.03
申请人 NITTO DENKO CORPORATION 发明人 ISHII JUN;NAITOU TOSHIKI;HONJO MITSURU
分类号 H05K1/00 主分类号 H05K1/00
代理机构 代理人
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