发明名称 Laser micromachining methods and systems
摘要 A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the substrate at least at approximately the area at which the laser energy is being directed. The assist medium is no longer provided prior to completion of formation of a feature in the substrate created utilizing the laser energy.
申请公布号 US7923658(B2) 申请公布日期 2011.04.12
申请号 US20040976555 申请日期 2004.10.29
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 HUTH MARK;ROURKE PHILIP G;GATES CRAIG M.
分类号 B23K26/00 主分类号 B23K26/00
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