发明名称 Atomic layer deposition method of forming conductive metal nitride-comprising layers
摘要 This invention includes atomic layer deposition methods of forming conductive metal nitride comprising layers. In one implementation, an atomic layer deposition method of forming a conductive metal nitride comprising layer includes positioning a substrate within a deposition chamber. A first species is chemisorbed to form a first species monolayer onto the substrate from a gaseous first precursor comprising at least one of an amido metal organic compound or an imido metal organic compound. The first species monolayer comprises organic groups. The chemisorbed first species is contacted with a second precursor plasma effective to react with the first species monolayer to remove organic groups from the first species monolayer. The chemisorbing and contacting are successively repeated under conditions effective to form a layer of material on the substrate comprising a conductive metal nitride.
申请公布号 US7923070(B2) 申请公布日期 2011.04.12
申请号 US20060497692 申请日期 2006.07.31
申请人 MICRON TECHNOLOGY, INC. 发明人 KRAUS BRENDA D.;MARSH EUGENE P.
分类号 C23C16/00;C23C16/34;C23C16/44;C23C16/455;H05H1/24 主分类号 C23C16/00
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