发明名称 Topping cycle for a sub-ambient cooling system
摘要 According to one embodiment of the disclosure, a cooling system for a heat-generating structure comprises a heat exchanger, a first structure, a condenser heat exchanger, and a second condenser. The heat exchanger is in thermal communication with a heat-generating structure. The heat exchanger has an inlet and an outlet. The inlet is operable to receive fluid coolant substantially in the form of a liquid into the heat exchanger, and the outlet is operable to dispense fluid coolant at least partially in the form of a vapor out of the heat exchanger. The first structure directs a flow of the fluid coolant substantially in the form of a liquid to the heat exchanger. Thermal energy communicated from the heat-generating structure to the fluid coolant causes the fluid coolant substantially in the form of a liquid to boil and vaporize in the heat exchanger. The condenser heat exchanger receives a flow of the fluid coolant at least partially in the form of a vapor from the heat exchanger and transfers at least a portion of the thermal energy within the fluid coolant to a heat sink. The second condenser assists the condenser heat exchanger in transferring at least a portion of the thermal energy within the fluid coolant away from the fluid coolant. The second condenser is selectively activated when the heat sink reaches an undesirable temperature.
申请公布号 US7921655(B2) 申请公布日期 2011.04.12
申请号 US20070859591 申请日期 2007.09.21
申请人 RAYTHEON COMPANY 发明人 WYATT WILLIAM G.;KVIATKOFSKY JAMES F.;PRUETT JAMES A.;ADAMS TIMOTHY E.;MOSHENROSE CHRISTOPHER
分类号 F25B21/02;F25B41/00;F25B49/00 主分类号 F25B21/02
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