| 发明名称 |
FILM-LIKE ADHESIVE, CONNECTION STRUCTURE OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.</p> |
| 申请公布号 |
KR20110036967(A) |
申请公布日期 |
2011.04.12 |
| 申请号 |
KR20117006892 |
申请日期 |
2006.03.15 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KATOGI SHIGEKI;IZAWA HIROYUKI;SUTOU HOUKO;YUSA MASAMI;FUJINAWA TOHRU |
| 分类号 |
C09J175/16;C09J9/02;C09J133/14;H01L21/60 |
主分类号 |
C09J175/16 |
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