| 发明名称 |
Low melting point frit paste composition and sealing method for electric element using the same |
| 摘要 |
The present invention relates to a low melting point frit paste composition and a sealing method for an electric element using the same, and more particularly, to a low melting point frit paste composition which is sealable and appropriate for a flat panel, protects an element weak to heat and improves a process yield with good print properties, and a sealing method for an electric element using the same.
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| 申请公布号 |
US7923393(B2) |
申请公布日期 |
2011.04.12 |
| 申请号 |
US20080271252 |
申请日期 |
2008.11.14 |
| 申请人 |
DONGJIN SEMICHEM CO., LTD. |
发明人 |
SON JUNG-HYUN;LEE SANG-KYU;JOO HAN-BOK |
| 分类号 |
C03C8/08;B29C65/16;C03B23/00;C03C3/21;C03C8/14;C03C8/16;C03C8/24;H01J9/26 |
主分类号 |
C03C8/08 |
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