发明名称 Base material for pattern-forming material, positive resist composition and method of resist pattern formation
摘要 A base material for a pattern-forming material, a positive resist composition, and a method of resist pattern formation that are capable of forming a high resolution pattern with reduced levels of LER. The base material includes a low molecular weight compound (X1), which is formed from a polyhydric phenol compound (x) that contains two or more phenolic hydroxyl groups and satisfies the conditions (1), (2), and (3) described below, wherein either a portion of, or all of, the phenolic hydroxyl groups are protected with acid dissociable, dissolution inhibiting groups: (1) a molecular weight within a range from 300 to 2,500, (2) a molecular weight dispersity of no more than 1.5, and (3) an ability to form an amorphous film using a spin coating method. Alternatively, the base material includes a protected material (Y1), which is formed from a polyhydric phenol compound (y) that contains two or more phenolic hydroxyl groups and has a molecular weight within a range from 300 to 2,500, in which a predetermined proportion of the phenolic hydroxyl groups are protected with acid dissociable, dissolution inhibiting groups.
申请公布号 US7923192(B2) 申请公布日期 2011.04.12
申请号 US20050590046 申请日期 2005.02.08
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 HIRAYAMA TAKU;SHIONO DAIJU;MATSUMIYA TASUKU;KINOSHITA YOHEI
分类号 G03C1/00;G03F1/00;G03F7/00;G03F7/004;G03F7/039 主分类号 G03C1/00
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