THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF AND PRINTED CIRCUIT BOARD USING THE SAME,申请号KR20090025313-传众专利搜索

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发明名称	THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF AND PRINTED CIRCUIT BOARD USING THE SAME
摘要
申请公布号	KR101028600(B1)	申请公布日期	2011.04.11
申请号	KR20090025313	申请日期	2009.03.25
申请人		发明人
分类号	C08L1/08;C08L63/00;C08L75/06;H05K1/03	主分类号	C08L1/08
代理机构		代理人
主权项
地址

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