| 摘要 |
<p>PURPOSE: A light emitting module is provided to improve heat dissipation efficiency by directly discharging heat from a light emitting device to a support member. CONSTITUTION: A substrate(60) has a plurality of grooves(55). A first circuit pattern(61) and a second circuit pattern(62) are electrically connected to a light emitting device(1). A first electrode(31), a second electrode(32), and a thermal conductive member(35) are installed on a body(10). A light emitting chip(20) is electrically connected to the first electrode and the second electrode. A heat radiation pad(50) is formed on the body and the lower side of the thermal conductive member.</p> |
